by: Akshay Panchwagh
from: Robert Bosch GmbH
In this use case, a Multi Chip Power Package (MCPP) equipped with a piezoresistive silicon-based stress sensor was used as a demonstrator to highlight the methodology of virtual release through referencing for reduction in development time. For this purpose, two different constructions of the MCPP were used – a B2 bridge and a B6 bridge. The B2 bridge was subjected to passive operating conditions, in which the power package remains inactive while the environmental conditions vary, and the B6 bridge, attached to a cooler, was subjected to active operating conditions in which the power package is actively powered.
The aim of using such operating conditions was an accelerated replication of the field conditions, in which the power package operates, and to test the response of the MCPP to such conditions. The demonstrators (B2 and B6 bridges), both equipped with an over-molded piezoresistive stress sensor, (called the iForce sensor) were used to analyze their thermomechanical response to the applied loading conditions and measure stress states within the power package during operations. During both the operations, the warpage response using a Digital Image Correlation (DIC) method, and stresses in the package with the help of iForce sensor were measured. The iForce sensor is a piezoresistive stress sensor, as mentioned previously, which consists of a silicon die of size 1,67 mm x 1,71 mm placed on a Low Temperature Co-Fired Ceramic (LTCC) substrate. Through usage of gold bond wires, it is connected to copper pillars, or pins which help in controlling the sensing cells of the sensor.
The sensor used in the demonstrator here has 36 sensing cells. These cells measure stresses in the package with the help of piezoresistive effect of silicon, in which its electrical resistivity changes upon application of stresses. The change is resistivity leads to change in the electrical current which flows through the sensor. The change in these current values helps to calculate the stresses within the package. The aim of measuring these responses was to draw comparisons between experimentally measured values, and their virtual responses to help validate the simulation models, which will be used subsequently as “credible” simulation models.
A B2-Bridge used for combined Warpage-and-Stress Measurement. Cables are connected to Pins of iForce Sensor to extract Stress Data.
A Combined Warpage-and-Stress Measurement of a B2-Bridge During Passive Temperature Cycling.
A B6-Bridge on Cooler with iForce Sensor Pins Visible.